Design of 25 kg heavy duty module aid. The deadweight friction of the module is superimposed with the insertion and removal force of the 13 pairs of connectors on the backplane. Pulling out the module causes the force of the connector to detangle more than 50 kg. Therefore, two large extractors are designed at the upper and lower ends of the computing module, and the extractor and base are cast with zinc alloy. Plug-ins such as disk modules, boards, I/O modules, and memory modules are designed for insertion and removal. The running stroke is calculated to ensure safe insertion and removal. OREA Engineering has accumulated more than 40 structural design cases to help customers meet various custom requirements.

Stress simulation is an important means of structural strength analysis in structural design. In the "simulation" workspace, it can save manufacturing time to try to use virtual design variants or adapt models to changing design requirements. Using tools in the "simulation" workspace minimizes physical prototyping and disruptive testing requirements. Trained structural engineers at OREA Engineering spend a lot of time conducting detailed analysis to obtain exact results of real world conditions. Of course, you can rely on basic conditions and past experience to judge and improve the design. If we recommend performing stress simulation analysis under limiting conditions such as space constraints, it can significantly improve the overall engineering process. Using the analysis tools in the Simulation workspace, you can determine how loads cause deformation and failure so that you know if and how a part will fail. Or you can determine the natural vibration frequency to avoid resonance. You can determine the temperature distribution and the stress caused by the heat.

Translation mechanism design. In special applications, modules are assembled using unconventional assembly designs to accommodate large or overweight hardware assemblies. The two boards installed on the same tray are inserted into the chassis and shifted more than 23 mm to the left through a screw structure to connect with the other board through a connector. The challenge is not only to translate in a very limited space, but also to achieve precise positioning and connector docking with the left side of the CPU board.

Carbon fiber composite material is a new type of fiber material with high strength and high modulus of carbon content above 95%. Carbon fiber has many excellent properties, such as high axial strength and modulus, low density, no creep, resistance to ultra-high temperature in non-oxidation environment, good fatigue resistance and other excellent properties. Carbon fiber also has good electrical and thermal conductivity and electromagnetic shielding properties. 1) Carbon fiber composite products break the limitations of traditional raw materials and process design, using composite materials, with light weight, high specific strength, high load ratio, corrosion resistance, strong environmental adaptability, impact resistance and high cost performance. 2) Carbon fiber composites have enough strength and stiffness to make them the lightest material for automobile bodies. It has been widely used in the automotive field. 3) The strength and toughness of carbon fiber composite material is much stronger than that of ordinary traditional plastics. It can be used to make parts of high strength with very thin material, and its weight is much lighter than that of metal with the same strength. Therefore, carbon fiber technology is widely used in UAV.

"Structural reliability mainly considers the strength of mechanical structure and the failure caused by fatigue, wear and fracture due to the influence of load; The reliability of mechanism mainly considers the failure caused by kinematic problems rather than the failure caused by strength problems. Redundancy design is to complete the specified function of the structure, spare parts, etc., in case of local failure, the whole machine or system still does not occur to the loss of the specified function of the design. When the reliability requirements of a certain part are very high, but the current technical level is difficult to meet, for example, the reliability design side sand such as derating design and simplified design cannot meet the reliability requirements, or the improvement cost of improving the reliability of parts is higher than the repeated configuration, the redundancy technology may become a perfect or better design method. For example, the use of double pump or double engine configuration of the mechanical system, but it should be noted that the redundant design often makes the volume of the machine, weight, cost are increased accordingly. Redundancy design improves the task reliability of mechanical system, but the basic reliability is reduced accordingly, so it should be used carefully. "

Server level design requires customizing server components to meet your needs. Whether you have special heat dissipation requirements, earthquake resistance requirements, high density requirements, or need a specific contour size, OREA Engineering can design and build custom solutions to meet your needs. After a prototype design model is created and engineering validated, it is sent to one of our production facilities in Northern California for construction. Rack level design begins with the selection of the appropriate cabinet type from the perspective of height, width, depth and weight treatment. 3D CAD software is used to create prototype design models and generate 2D documents and send them to our cabinet manufacturing facility in Shenzhen. After engineering verification, the cabinet is built.

Boards or modules are connected to the front and back of the backplane of a high-configuration rack server, and the force of inserting and removing boards or modules is very large. Therefore, the stiffness of the backplane alone will cause great deformation against the force of inserting and removing boards. The backplane needs structural strengthening design. Two 1.2mm stamped backplane supports are sandwiched in the middle of the backplane. After the backplane is installed, the backplane is locked and fixed. When installing the backplane support (including the backplane), place the backplane support on the support mounting seat and push it inward (forward) until the positioning pins enter the positioning holes. Then, loosen and secure the backplane support. Open ventilation holes above and below the partition board in the chassis to dissipate heat from the power supply.