Product Demand Management
Project requirements are systematically analyzed and transformed into requirements documents that guide subsequent design.
Communicate with customers to clarify their specific requirements for the project, convert them into requirements documents that can guide subsequent design, and output subsequent product specifications based on the requirements documents.
1) CPCI calculation board -A
Functional features:
△ Two onboard Dragon Son 3A quad-core processors, supporting the Kirin operating system
△ AMD RS780E North bridge + AMD SB710 south bridge
△ Onboard 4GB DDR3-800 dual-channel memory, 64GB SSD, CF card slot, and 2 SATA in the rear I/O
Integrated video card with 128MB video memory and one VGA output
△ Standard 6U size 4HP*266mm*160mm (H*W*D)
△ -20 ℃ ~+60℃ industrial grade, -40 ℃ ~+70℃ military grade
△ PICMG2.0, PICMG2.1, PICMG2.16
Functional features:
△ Intel Core i7-610E High-performance CPU, Intel QM57 chipset
△ On-board 4GB DDR3 ECC dual-channel memory particles
△ 32/64bit, 33/66Mhz CPCI bus
Integrated Intel HD Graphics 3000 graphics card, 2 DVI, 1 VGA (can be front and rear out)
△ Two GE in front and four GE in back
△ PCIe X8 bus expansion, expansion of high-performance XMC graphics cards and network cards
△ Standard 6U size 4HP*266mm*160mm (H*W*D)
△ -20 ℃ ~+60℃ industrial grade, -40 ℃ ~+70℃ military grade
△ PICMG2.0, PICMG2.1, PICMG2.16
Functional features:
▽ Intel 3 generation i7 3612QE four core eight thread high performance CPU
△ On-board 8GB DDR3 ECC dual-channel memory
△ -40 ℃ ~+70℃ wide temperature environment
△ 10GE communication, good high-speed serial bus signal integrity design
△ Provide Mark0~Mzrk7 module coding identification and system monitoring
△ Resistance to vibration, shock, wide temperature and other harsh environment characteristics
△ 28V DC power supply, support 18V to 32V input range
Functional features:
△ Intel Third-generation i7 3612QE or 3555LE High-performance CPU, Intel QM77 chipset
△ On-board 8GB DDR3 ECC dual-channel memory particles, 16GB SSD
△ Intel HD Graphics 4000 set display, 1 VGA (can be front and back out)
△ One onboard mSATA supports SATA3.0, and two SATA2.0 can be deployed for expansion
△ One GE in front and one GE in back
△ Standard 3U size 5HP*133mm*160mm (H*W*D)
△ -20 ℃ ~+60℃ industrial grade, -40 ℃ ~+70℃ military grade
△ Compatible with VITA46 and VITA65
Functional features:
△ Domestic mega core KH-S20000, mega core ZX-200 chipset
△ Dual-channel DDR4 memory structure, with 4 x DDR4 DIMM Slots, supports up to 128GB of capacity and up to 32GB of single DIMM slots
△ 10x SATA 3.0 port (3.5 inch HDD), extensible support SAS HDD
△ 1 x PCI-E 3.0*16 Slot, 1 x PCI-E 3.0*8 Slot
△ 4 x GbE RJ45 ports, 1 x GbE RJ45 ports Management ports
△ Byosoft BIOS supports Linux and Windows
△ Operating temperature -10℃~50℃(operation), storage temperature -45℃ ~70℃, MTBF> 100,000 hours
Functional features:
△ Network security motherboard based on intel x86 architecture, Intel Apollo Lake J3355/J3455
△ 8GB DDR3L-1866
△ 1 x mSATA 3.0, 1 x SATA 3.0(3.5 inch HDD supported)
△ Can support extended data encryption card and data isolation card
△ Supports two G3 Bypass routes
△ AMI BIOS supports Linux 2.6.30 or higher
△ Operating temperature -10℃~50℃(operation), storage temperature -45℃ ~70℃, MTBF> 100,000 hours
Functional features:
△ 5G/6.25G/10G/40G VPX high-speed backplane
△ Reinforced chassis
Specification decomposition
Transform the customer's product requirements into the Design Specification that the product can realize, and confirm and revise the product requirements based on the analysis results at this stage to ensure the final realization of the product. At the same time, based on the design concept of integrated product development (IPD), in this stage, I set the product specification requirements from the aspects of testability, manufacturability and availability, and reached agreement with the customer.
Product System Design Services
Including system scheme design, software detailed design, hardware detailed design.
Choose the best design scheme from the cost, quality and development time of the product, grasp the success rate of the design of the product from the perspective of the system, the scheme should be confirmed with the customer and take full account of the special requirements of the customer.
Product software design, including embedded software design, application software design, Linux application and kernel software development, the main scenarios include: storage management software, server management software, mobile APP (Android, Apple).
Product hardware system design, including schematic design, PCB design, BOM production and optimization, product hardware module design, and high speed signal simulation (SI), power integrity analysis (PI) for complex products.
Including hardware unit test and system test, power integrity test, signal integrity test, eye chart test, clock calibration, and we can provide customers with separate outsourcing testing services.
Software Testing
Including test case design, function point testing, system testing, support black box testing and white box testing, at the same time we can provide customers with separate outsourcing testing services.
System Test
Assist the system testing and certification of hardware and software, including safety testing, electromagnetic compatibility testing, reliability testing, environmental testing, mechanical testing, etc. Assist the third party to complete the corresponding testing and certification, and optimize the system index of the product.
Product Engineering Service
Including customer prototype trial production, product data development.
Provide engineering prototype trial production and small batch trial production services for customers, can follow the line in the processing plant designated by customers, verify the producibility of products, output various production instructions and production documents, and design production testing equipment for customers.
Product Data Development
Provide all kinds of product information development for customers, including "User Manual", "Product Specification", "Publicity color pages", "Packaging List", etc., can also be added according to customer needs.
Management Advisory Aervices
Including R & D process construction and optimization, optimized device library construction.
OREA Engineering team is a hardware and software design team with many years of IPD practical development experience, and has a deeper understanding of IPD. We can use our practical experience to help customers establish or optimize the R & D process system. We can not only build a skeleton of R & D management, but also establish a variety of basic templates and forms for customers, as well as R & D training system. The R&D system and process can be adjusted and optimized according to the size of the R&D team and the specific situation of different industries.
Optimized device library construction
Help customers to establish unified device library management, and achieve the optimal grade classification of devices, device certification introduction management, from the source to grasp the product design quality and mass production of material availability.
Structure Design
Structure is the skeleton of the product, is the carrier of all engineering technology and user experience, the whole machine structure design is the link between the product concept and product anufacturing, it includes production, assembly, cost...
Engineering Simulation
Engineering simulation can help users to see the results in the concept phase, narrowing the gap between the design and reality. It's like to see the future, in the form of a risk-free to innovate in an unprecedented fashion...
FULL SUPPLY CHAIN
SOLUTION from
DESIGN to PRODUCTION
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